Heat dissipating device for a semiconductor package



FIG. 1 is a front view of an embodiment of the heat dissipating device for a semiconductor package;

FIG. 2 is a rear view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a perspective view thereof;

FIG. 7 is a sectional view taken along line 7--7 in FIG. 5 with an attached semiconductor package shown in broken lines only since the semiconductor package does not form any part of the claimed design;

FIG. 8 shows the same side view as FIG. 5 with an attached semiconductor package shown in broken lines only since the semiconductor package does not form any part of the claimed design; and,

FIG. 9 is a top view in the direction of the arrow IX seen from a position perpendicular to the top surface of the heat dissipating device for a semiconductor package. 

The ornamental design for a heat dissipating device for a semiconductor package, as shown and described. 